| #534521 in Books | 1988-12-31 | Original language:English | PDF # 1 | 9.50 x6.75 x2.25l,.0 | File type: PDF | 1194 pages||About the Author|Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the ent
The Microelectronics Packaging Handbook continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing processes. Now available on CD-ROM for the first time, it discusses state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a naviga...
You can specify the type of files you want, for your gadget.Microelectronics Packaging Handbook | R.R. Tummala. I really enjoyed this book and have already told so many people about it!
