[PDF.07yn] Wafer-Level Testing and Test During Burn-In for Integrated Circuits (Artech House Integrated Microsystems)

Wafer-Level Testing and Test During Burn-In for Integrated Circuits (Artech House Integrated Microsystems)

[PDF.wr51] Wafer-Level Testing and Test During Burn-In for Integrated Circuits (Artech House Integrated Microsystems)

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 | #4896274 in Books |  Artech House |  2010-02-01 | Original language:English | PDF # 1 |  9.10 x.70 x6.20l,.95 | File type: PDF | 198 pages

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||0 of 0 people found the following review helpful.| Five Stars|By moshirazi|Good product|1 of 1 people found the following review helpful.| No real world usefulness|By Jesper|This was obviously written from the view of a disconnected academic with no time in a burn in lab or test floor to understand how to actually get things done. I saw nothing of value here that would actuall

Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This hands-on resource provides a comprehensive analysis of these methods, showing how wafer-level testing during burn-in (WLTBI) helps lower product cost in semiconductor manufact...

You easily download any file type for your gadget.Wafer-Level Testing and Test During Burn-In for Integrated Circuits (Artech House Integrated Microsystems)   |  Sudarshan Bahukudumbi. I was recommended this book by a dear friend of mine.

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