[PDF.12si] Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications

Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications

[PDF.uu62] Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications

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 | #2500630 in Books |  Shichun Qu Yong Liu |  2014-09-11 | Original language:English | PDF # 1 |  9.21 x.81 x6.14l,.0 | File type: PDF | 322 pages

 | Wafer Level Chip Scale Packaging Analog and Power Semiconductor Applications

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||0 of 0 people found the following review helpful.| Good book for entry to senior level pacakging engineers|By DQu|Not a one-cover-all (the details) book, but good reference for even seasoned packaging engineers and colledge students who are considering entering the field.|0 of 0 people found the following review helpful.| Five Stars|By William Bowerman|Up to date and provides a| ||“Wafer Level Chip-Scale Packaging by Qu, Shichun, Liu, Yong presents good technical insights of wafer-level chip scale packaging (WLCSP) technology, suitable for both industry and academic practitioners. … It is a good reference to demonstrate th

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliabilit...

You easily download any file type for your device.Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications   |  Shichun Qu, Yong Liu. Which are the reasons I like to read books. Great story by a great author.

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