[PDF.05jg] Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)

Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)

[PDF.yx91] Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)

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 | #3549552 in Books |  Chuan Seng Tan Ronald J Gutman |  2008-09-19 | Original language:English | PDF # 1 |  9.21 x.88 x6.14l,1.45 | File type: PDF | 410 pages

 | Wafer Level 3 D ICS Process Technology

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||From the Back Cover||Wafer Level 3-D ICs Process Technology focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses alternative technology platforms for pre-packaging wafer level 3-D ICs, with

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

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You easily download any file type for your gadget.Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)   |  From Chuan Seng Tan Ronald J Gutman. I was recommended this book by a dear friend of mine.

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