[PDF.07hw] Through-Silicon Vias for 3D Integration

Through-Silicon Vias for 3D Integration

[PDF.ft07] Through-Silicon Vias for 3D Integration

Through-Silicon Vias for 3D  Dr John H. Lau epub
Through-Silicon Vias for 3D  Dr John H. Lau pdf download
Through-Silicon Vias for 3D  Dr John H. Lau pdf file
Through-Silicon Vias for 3D  Dr John H. Lau audiobook
Through-Silicon Vias for 3D  Dr John H. Lau book review
Through-Silicon Vias for 3D  Dr John H. Lau summary

 | #2166543 in Books |  McGraw-Hill Professional |  2012-10-11 | Original language:English | PDF # 1 |  9.30 x.90 x6.30l,1.50 | File type: PDF | 512 pages

 | 

---

||About the Author||John H. Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, ITRI Fellow, spent 30 years in the electronics industry (HP and Agilent) in Palo Alto, California, and currently serves as a fellow at the Electronics & Optoelectronics Laboratories, In

A comprehensive guide to TSV and other enabling technologies for 3D integration

Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-fac...

You easily download any file type for your gadget.Through-Silicon Vias for 3D Integration   |  Dr John H. Lau. I really enjoyed this book and have already told so many people about it!

Download Now