[PDF.76ig] The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
Gerard Kelly
[PDF.tu67] The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
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| #7454322 in Books | Springer | 1999-04-30 | Original language:English | PDF # 1 | 9.21 x.50 x6.14l,.90 | File type: PDF | 134 pages | |
One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time. How can this be done? Firstly, package structures, materials, and manufacturing processes must be optimised. Secondly, it is necessary to predict the likely failures and behaviour of parts before manufacture, whilst minimising the amount of tim...
You easily download any file type for your device.The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages | Gerard Kelly.Not only was the story interesting, engaging and relatable, it also teaches lessons.