[PDF.13aa] Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
Sheng Liu, Yong Liu
[PDF.qx94] Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
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| #3066602 in Books | 2011-05-17 | Original language:English | PDF # 1 | 9.90 x1.40 x6.90l,2.50 | File type: PDF | 576 pages||0 of 1 people found the following review helpful.| Four Stars|By Jun Lu|good books with details.
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulatio...
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