[PDF.90zz] Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

[PDF.py76] Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

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 | #3573417 in Books |  Michael G Pecht |  1994-03-01 | Original language:English | PDF # 1 |  9.67 x1.04 x6.48l,1.85 | File type: PDF | 426 pages

 | Integrated Circuit Hybrid and Multichip Module Package Design Guidelines A Focus on Reliability

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||From the Publisher|Presents a set of production guidelines for reliable microelectronic packages such as microprocessors and memory chips. Furnishes an organized, disciplined and time-phased approach to the design, development, qualification, manufacturing, and

Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals.

Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to:
* Define realistic syst...

You can specify the type of files you want, for your device.Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability   |  Michael Pecht. I was recommended this book by a dear friend of mine.

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