[PDF.01bk] Fine Pitch Surface Mount Technology: Quality, Design, and Manufacturing Techniques (Electrical Engineering Series)

Fine Pitch Surface Mount Technology: Quality, Design, and Manufacturing Techniques (Electrical Engineering Series)

[PDF.ci33] Fine Pitch Surface Mount Technology: Quality, Design, and Manufacturing Techniques (Electrical Engineering Series)

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 | #5340899 in Books |  Phil Marcoux |  1992-07-31 | Original language:English | PDF # 1 |  9.21 x.81 x6.14l,1.48 | File type: PDF | 340 pages

 | Fine Pitch Surface Mount Technology Quality design and manufacturing techniques Electrical Engineering

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Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose...

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