[PDF.01kd] Cooling Of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Wspc Series in Advanced Integration and Packaging) (Volume 3)
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Cooling Of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Wspc Series in Advanced Integration and Packaging) (Volume 3)
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[PDF.dr66] Cooling Of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Wspc Series in Advanced Integration and Packaging) (Volume 3)
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| #7806926 in Books | 2014-10-23 | 2014-08-25 | Original language:English | PDF # 1 | 9.00 x1.06 x6.00l,.0 | File type: PDF | 472 pages||From the Inside Flap|To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal man
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D pa...
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