[PDF.65ee] Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology
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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology
Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann
[PDF.tn24] Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology
Chemical-Mechanical Polishing of Low Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann epub Chemical-Mechanical Polishing of Low Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann pdf download Chemical-Mechanical Polishing of Low Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann pdf file Chemical-Mechanical Polishing of Low Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann audiobook Chemical-Mechanical Polishing of Low Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann book review Chemical-Mechanical Polishing of Low Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann summary
| #6089729 in Books | CRC Press | 2002-09-30 | Original language:English | PDF # 1 | 9.21 x.69 x6.14l,1.18 | File type: PDF | 229 pages | ||1 of 1 people found the following review helpful.| Good textbook on the subject|By Newton Ooi|This book gives a solid, easy to read introduction to CMP and all the different factors associated with it. The text is accessible to any undergraduate in engineering, yet contains a lot of information that makes it handy as a reference.
As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanic...
You can specify the type of files you want, for your gadget.Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology | Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann. I have read it a couple of times and even shared with my family members. Really good. Couldnt put it down.
