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| #3401048 in Books | Springer | 2001-10-31 | Original language:English | PDF # 1 | 10.00 x7.00 x2.25l,.0 | File type: PDF | 1192 pages | |
This handbook provides a comprehensive treatment of area-array interconnections for both chips and microelectronic packages in terms of optimizing densification, functionality and reliability. It provides comparisons with alternative and competing technologies, clearly defining cost versus benefit tradeoffs and strategies. Process details are defined in the order of their typical manufacturing sequence, indicating tooling requirements and potential yield detractor...
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