[PDF.53vp] Advances in 3D Integrated Circuits and Systems (Series on Emerging Technologies in Circuits and Systems)
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Advances in 3D Integrated Circuits and Systems (Series on Emerging Technologies in Circuits and Systems)
Hao Yu
[PDF.vq58] Advances in 3D Integrated Circuits and Systems (Series on Emerging Technologies in Circuits and Systems)
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| #317944 in Books | 2015-10-28 | 2015-08-28 | Original language:English | PDF # 1 | 9.00 x.89 x6.00l,.0 | File type: PDF | 392 pages||From the Inside Flap|3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs. Contents presented in this book include fabrication techniques for 3D Tsv and 2.5D Tsi; device modeling; physical designs; thermal, power and I/O management; and 3D design...
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