[PDF.89uh] 3D IC Integration and Packaging (Electronics)

3D IC Integration and Packaging (Electronics)

[PDF.tm50] 3D IC Integration and Packaging (Electronics)

3D IC Integration and  Dr John H. Lau epub
3D IC Integration and  Dr John H. Lau pdf download
3D IC Integration and  Dr John H. Lau pdf file
3D IC Integration and  Dr John H. Lau audiobook
3D IC Integration and  Dr John H. Lau book review
3D IC Integration and  Dr John H. Lau summary

 | #264093 in Books |  McGraw-Hill Professional |  2015-08-27 | Original language:English | PDF # 1 |  9.50 x1.15 x7.70l,.92 | File type: PDF | 480 pages

---

||About the Author||John Lau, Ph.D., is both an ASME and an IEEE fellow. He has written 17engineering books, published more than 425 peer-reviewed papers, and given 290lectures, workshops, and keynotes worldwide.

A comprehensive guide to 3D IC integration and packaging technology